Combined with an overmolding process, it results in a more robust inverter module with increased power density, lower cost, and reduced weight to be supplied to a major global customer from mid-2025.
As the mobility industry continues to work toward more affordability and widespread EV (electric vehicle) adoption, automotive suppliers are continuously introducing new technologies to help bring down costs for OEMs. A recent example is German powertrain technology company Vitesco Technologies GmbH, which announced the development of a new power module for electric vehicles at a media event during this week’s Detroit Auto Show.
According to Vitesco Technologies, its new power modules combine state-of-the-art silicon carbide (SiC) chip technology with overmolding, which results in a robust product with increased power density, lower cost, and reduced weight. The new product consists of three overmolded half-bridges and forms the core of an EV’s inverter system, which controls an EV’s drive energy and energy recovery.
The transfer molding manufacturing process involves a dielectric material to protect electronic components, resulting in a more robust, cost-effective, and reliable power module. Vitesco Technologies has been using its transfer molding process since 2020, first applying it to compact transmission control units. The new power module will be manufactured at the company’s plant in Nuremberg and is slated to be delivered to a large global automotive OEM starting in 2025.
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